厚膜研发工程师英文简历
[10-20 21:05:27] 来源：http://www.88jianli.com 英文简历模板 阅读：280次
概要： Educational Background Name of School: Wuhan University of Science and Technology Highest Degree: Bachelor Date of Graduation: 2004-07-01 Name of Major 1: mechanical engineering and automation Name of Major 2: Education experience: Start dateEnd dateEducation organizationMajorsCertificateCertificate No2000-092004-07Wuhan University of Science and Technologymechanical eng
厚膜研发工程师英文简历,标签：英文简历范文,英文简历范本,http://www.88jianli.com| Educational Background |
| Name of School: | Wuhan University of Science and Technology | ||||||||||||||
| Highest Degree: | Bachelor | Date of Graduation: | 2004-07-01 | ||||||||||||
| Name of Major 1: | mechanical engineering and automation | Name of Major 2: | |||||||||||||
| Education experience: |
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| Language Ability |
| Foreign Language: | English | Level: | good |
| Chinese level: | normal | Cantonese Level: | normal |
| Relevant skills and abilities |
| After graduating I work for Ambit (Foxconn), the current job is the thick film department of new product project leader, responsible for a major new product process as follows: Circuit Assembly (wafer dicing, flip chip, reflow, dispensing, testing, Circuit sawing), Substrate Assembly (printing, firing, resistor laser trim, testing). 5-years thick film product development, integrated circuit chip package assembly work experience, familiar with the RF package production process. Particularly in the following jobs has accumulated a wealth of practical experience: 1.Be familiar with substrate printing screen/stencil design and modification. 2.Be skilled in evaluation and selection of substrate assembly (conductor/resistor/dielectric paste, ceramic substrate, and clean solvent) and circuit assembly (solder paste, flux, under hill, blade, and clean solvent). 3.Be skilled in customer drawing review and modification, gap analyzes report provided. 4.Be good at planning new projects, gathering resources and coordination, setting up BOMs, product pricing, tooling design, introduction into mass production and relevant system documents like MFG, SOP, etc. 5.Be good at DOE to carry out experimental design and using Minitab to analyze the experiment. 6.Be good at SPC system, like7QC, FMEA, Control plan and Control MSA. 7.Deeply understand team management and process improvement, like TQM and cost down. 8.Proficient in Office tools, such as Excel, Word, PowerPoint, Notes, etc. 9.Proficient in Auto CAD, CAM350 and GC-GAM. Be capable to analyze and improve the structure and function of products by using these engineering applications. |
| Self-recommendation letter |
| Five years experienced in new product introduce and project management in a world-class corporation. Be positive, creative and willing to work as a team. Have strong independent problem-solving and communication skills, and be capable to help customers to solve the problem quickly to meet customer requirements. Hope to make full use of 5 years in the semiconductor company development of new products, and customer coordination and communication experience for your company. |
Tag:英文简历模板，英文简历范文,英文简历范本，简历大全 - 英文简历模板
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