[10-20 21:06:36] 来源：http://www.88jianli.com 英文简历模板 阅读：280次
概要： Personal Details Name: Mr. TY Yin Nationality: China (Mainland) Current Place: Shenzhen Height/Weight: 150 cm40 kg Marital Status: Single Age: 29 years Career Objective Application type: Jobseeker
硬件工程师英文简历范文,标签：英文简历范文,英文简历范本,http://www.88jianli.com
| Name: |
Mr. TY Yin |
Nationality: |
China (Mainland) |
| Current Place: |
Shenzhen |
Height/Weight: |
150 cm40 kg |
| Marital Status: |
Single |
Age: |
29 years |
| Application type: |
Jobseeker |
| Preferred job title: |
Communication Technology Engineer: Engineer 、 Hardware Engineer: 、 Electronics Engineer/Technician: |
| Working life: |
5 |
Title: |
primary title |
| Job type: |
Full time |
Expected Start date: |
In a month |
| Expected salary: |
￥12,000--￥20,000 |
Preferred working place: |
Shenzhen |
| Company's name: |
Wicresoft Co. LTD.Begin and end date: 2006-12-2009-09 |
| Enterprise nature: |
Soly foreign funded enterprisesIndustry: |
| Job Title: |
Design Verification Engineer |
| Job description: |
Design Verification Engineer for Silicon components inside consumer electronic products. Working in Microsoft Aisa Center for Hardware (Shenzhen, China) as a vendor employee.
1. FA on silicon related defect units to improve the quality of silicon components.
2. Provide technical support on maintanance of the silicon component system level test in vendor sites.
3. Reduce the cost by improving the repair effectiveness.
4. Provide local support to team members who located in the US. |
| Reasons for leaving: |
|
| |
| Company's name: |
Mitac Computer (Shunde) Co. LTD.Begin and end date: 2004-07-2006-12 |
| Enterprise nature: |
Soly foreign funded enterprisesIndustry: Computer/Internet/Communication/Electronics |
| Job Title: |
ProductEngineer |
| Job description: |
Product Engineer for desktop PC product.
1. Highly involved from EV to MP of new Product. FA on failure unit to isolate the design or manufacturing problems.
2. Design and maintan Function Test coverage/program/procedure in PCBA and system level for OEM and ODM products.
3. Improve the fucntion test stability/coverage, and also the quality of the products.
4. Reduce the cost of function test of OEM and ODM products.
5. Provide technical support to improve manufacturing pass yield |
| Reasons for leaving: |
|
|
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